5G Module

Module Features

Core function

• Network standard: Supported 5G NR Sub-6GHz (SA/NSA)、LTE-FDD/TDD、WCDMA/HSPA+
• Interface type：M.2 Key B，supporting PCIe 3.0 x4 和 USB 3.1 Gen2
• GNSS：Integrated multi-mode positioning (GPS/GLONASS/BeiDou/Galileo/QZSS), supporting L1+L5 dual-band（AT command or hardware control）
• HPUE Enhance：Supports Class 2 power level (26 dBm), improving cell edge coverage
• Industrial-grade Design: operating temperature -40°C to +85°C, dimensions 30×52×2.3mm

Model comparison

Type	Supported frequency bands	**HPUE frequency bands **	GNSS
RM520N-GL	5G: n1/n3/n5/n7/n28/n38/n40/n41/n77/n78/n79; LTE: B1/B3/B5/B7/B8/B20/B28/B38/B40/B41	n38/n41/n77/n78/n79	L1+L5（Reserved）
RM520N-EU	5G: n1/n3/n7/n28/n41/n77/n78; LTE: B1/B3/B7/B8/B20/B28/B41	n41/n77/n78	L1+L5
RM520N-CN	5G: n41/n78/n79; LTE: B1/B3/B5/B8/B41	n41/n78/n79	L1+L5

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Specifications

Electrical characteristic

Parameter	Specification
Supply Voltage	3.135V - 4.4V (Typ. 3.7V)
5G Peak Power Consumption	3.5A @ 3.7V (256QAM Modulation)
LTE Peak Power Consumption	2.0A @ 3.7V (256QAM Modulation)
Operating Temperature	-40°C to +85°C (Industrial Grade)
Storage Temperature	-40°C to +90°C
ESD Protection	Contact Discharge ±5kV, Air Discharge ±10kV

RF Performance

Internet Type	Frequency Band	Downlink Rate	Uplink rate	MIMO Configuration
5G NR	n41/n78（dual carrier aggregation）	2.5 Gbps	900 Mbps	4×4 MIMO
LTE	B41（5CA）	2 Gbps	200 Mbps	4×4 MIMO

Interface Specifications

M.2 Key B	Specifications
PCIe 3.0	4 channels（x4 Lane），theoretical bandwidth 32 Gbps, support NVMe protocol
USB 3.1 Gen2	10 Gbps rate, compatible with USB 2.0, support UVC protocol extension
(U)SIM	Dual SIM single standby, 1.8V/3.0V compatible, support hot swap (need AT+QSIMDET to enable)

Instructions

1. Interface Configuration

   • PCIe Mode Switching：

     AT+QCFG="pcie/mode",1    // switch to RC mode
     AT+QCFG="pcie/bandwidth",1 // configuring x4 lanes
   • GNSS Control：

     AT+QGPS=2          // enable L1+L5 dual-frequency positioning
     AT+QGPSEND        // turn off GNSS

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Precautions

Key Design Points

1. Power Supply Stability

   • Transient voltage must be ≤50mV (use low ESR capacitors to suppress ripple).
   • Never cut power directly. Use AT+QPOWD command for soft shutdown or pull FULL_CARD_POWER_OFF low for at least 900ms.

2. ESD Protection

   • Add TVS arrays to all interfaces (junction capacitance ≤10pF).
   • SIM card trace length ≤200mm with 22Ω series resistor for EMI suppression.

3. Thermal Management

   • Apply thermal pads (thermal conductivity ≥5W/m·K) or heatsinks (covering module shield) during high-load operation.
   • Avoid proximity to heat sources. Maintain ≥50% exposed copper area on PCB.

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Safety and Maintenance

• Prohibited Actions

  • Avoid ultrasonic cleaning (damages crystals). When using alcohol to wipe, disconnect the power supply.
  • In high-temperature environments (>85°C), use with derating and disable HPUE mode.

• Firmware Upgrade

  • Upgrade via USB 3.1 or PCIe interface. Ensure a stable power supply (voltage ≥3.3V).

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Appendix

• Mechanical Dimensions：330.0mm × 52.0mm × 2.3mm (M.2 Key B), ≥2.5mm clearance required for heat dissipation area.

• Key AT Commands：

  AT+CFUN=4        // Enter flight mode
  AT+QSCLK=1       // Enable sleep mode
  AT+QCFG="data_interface",0,0 // Switch to USB mode

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